高级检索

PECVD制程中N+A-SI Layer沉积最佳工艺参数的探究

Optimization of Plasma Enhanced Chemical Vapor Deposition Conditions for Growth of N+A-SI Layer

  • 摘要: 本文采取4因子4水平田口设计,用等离子体增强化学气相沉积法制备了沉积在白玻璃上的单层N+A-SI:H薄膜,测试了薄膜的应力,膜厚,折射率,透过率,及SI-H/N-H键含量,综合评价不同参数配比条件下N+A-SI:H单层膜的膜质表现,针对比较重要的参数:沉积速率,Thickness Uniformity,SI-H键含量进行了田口分析,两阶段策略优化选出PECVD制程中的N+A-SI layer的最佳参数配比为:Pressure-385.7 Pa,Spacing-20.32 mm,RF Power-13000W,Gas Ratio-3.12。

     

    Abstract: The N+A-SI:H(NP) monolayer films,a key material in fabrication of thin film transistor liquid crystal display(TF-LCD),were synthesized by plasma enhanced chemical vapor deposition(PECVD) on glass substrate on industrial scale.The influence of the growth conditions:including,but not limited to the RF power,pressure,flow-rate ratio of PH3/SiH4,diffuser/susceptor spacing and deposition rate,on the mechanical and electronic properties of the NP layer,such as the stress distribution,thickness,refractive index,transmittance,uniformity of Si-H bond,contents of Si-H/N-H bonds,was investigated with a 4-factor 4-level Taguchi design and experimentally evaluated for optimization of the film growth conditions.The results show that high quality NP layer can be routinely deposited by PECVD on the production line under the optimized conditions:a pressure of 385.7 Pa,a spacing of 20.32 mm,a RF power of 13000 W and a PH3/SiH4 flow-rate ratio of 3.12.

     

/

返回文章
返回