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强脉冲电流对Cu-SiCp/AZ91D组织和性能的影响

Modification of Mg-Alloy AZ91D by Adding Cu-Coated SiC Powder and by Passing Pulse Current

  • 摘要: 在不同强脉冲电流作用下制备Cu-SiCp/AZ91D复合材料,分析了复合材料的组织结构及相组成,并对其组织形成机理和显微硬度进行研究。结果表明:Cu-SiCp/AZ91D复合材料主要由基体α-Mg,沿晶界增长的第二相离异共晶β-Mg17Al12以及沿β相生长的硬质强化相Mg2Si组成,有少量Cu弥散分布在β相上。未施加强脉冲电流的复合材料晶粒尺寸较大;施加强脉冲电流后晶粒得到细化,脉冲峰值电流为1500 A时晶粒尺寸最小。脉冲峰值电流在0~1500 A时,晶粒以形核为主,所得晶粒尺寸随着脉冲峰值电流增加而减小;脉冲峰值电流在1500~2000 A时,晶粒以长大为主,晶粒尺寸随着脉冲峰值电流增加而增大。Cu-SiCp/AZ91D复合材料显微硬度增长趋势与晶粒细化效果一致,未施加强脉冲电流的复合材料平均显微硬度最小,为HV4.959.73,脉冲峰值电流在1500 A时显微硬度最大,为HV4.971.08。

     

    Abstract: The bulk Mg-alloy, AZ91 D, was modified by adding the Cu-coated SiC powder in a pre-drilled hole and by passing a strong pulsed current at a high temperature. The effect of the pulse current on the microstructures, phase-structures and micro-hardness was investigated with X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy and hardness indentation. The results show that the pulse current had a major impact. For example, the modified AZ91 D alloy comprised α-Mg matrix, divorced eutectic β-Mg17Al12 at grain boundaries, reinforced phase Mg2Si along β-phase and a little Cu around the β-phase. As the peak current increased, the grain-size changed in a decrease-increase mode, decreasing to the smallest at 1500 A and increasing in 1500~2000 A range.In contrast, the micro-hardness varied in an increase-decrease manner. A peak current of 1500 A increased the micro-hardness from an average of HV4.959. 73 of the control sample to the highest of HV4.971. 08.

     

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