基于PIC-MCC模型的真空开关弧后鞘层仿真研究
Post-Arc Sheath of Vacuum Circuit Breaker: A Simulation Study in PIC-MCC Method
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摘要: 真空开关的零区鞘层仿真研究对于深入了解其弧后介质恢复过程具有重要意义。本文采用PIC-MCC模型,研究小电流开断情况下的真空开关弧后鞘层发展过程。通过仿真得到了鞘层发展阶段的粒子空间分布、密度分布和电势分布等微观参数。采用对照分析法,研究不同初始等离子体密度、原子密度和暂态恢复电压(TRV)上升率等对鞘层发展的影响,结果表明:在其他参数设置保持不变的情况下,初始等离子体密度越大,鞘层发展越慢;初始原子数密度越大,鞘层发展越慢;TRV斜率越大,鞘层发展越快。Abstract: The post-arc sheath development of vacuum circuit breaker(VCB),operating at a low current,was mathematically modeled and numerically simulated in article-in-cell Monte Carlo collision(PIC-MCC)method with VSim software.The influence of the plasma density,metal atom density and rising-rate of transient recovery voltage(TRV)on the sheath growth was investigated.The distributions of the potential,particle and particle density were calculated.The simulated results show that the ion and atom densities and TRV all have a major impact.To be specific,with all other parameters unchanged,an increase of the initial plasma density and/or atom density slows down the sheath growth;whereas an increase of TRV-slope speeds up the sheath development.
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