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张军, 沈玙璠, 苏天聪. 自支撑BaTiO3薄膜的制备与铁电性研究[J]. 真空科学与技术学报, 2024, 44(4): 369-375. DOI: 10.13922/j.cnki.cjvst.202401021
引用本文: 张军, 沈玙璠, 苏天聪. 自支撑BaTiO3薄膜的制备与铁电性研究[J]. 真空科学与技术学报, 2024, 44(4): 369-375. DOI: 10.13922/j.cnki.cjvst.202401021
ZHANG Jun, SHEN Yufan, SU Tiancong. Preparation and Ferroelectric Properties of Freestanding BaTiO3 Thin Films[J]. CHINESE JOURNAL VACUUM SCIENCE AND TECHNOLOGY, 2024, 44(4): 369-375. DOI: 10.13922/j.cnki.cjvst.202401021
Citation: ZHANG Jun, SHEN Yufan, SU Tiancong. Preparation and Ferroelectric Properties of Freestanding BaTiO3 Thin Films[J]. CHINESE JOURNAL VACUUM SCIENCE AND TECHNOLOGY, 2024, 44(4): 369-375. DOI: 10.13922/j.cnki.cjvst.202401021

自支撑BaTiO3薄膜的制备与铁电性研究

Preparation and Ferroelectric Properties of Freestanding BaTiO3 Thin Films

  • 摘要: BaTiO3 (BTO)铁电氧化物薄膜因其在非易失信息存储、智能传感、生物医疗、纳米发电机等领域潜在的应用而受到了人们的广泛关注。目前,为了保证BTO薄膜能高质量外延生长,通常选择晶格匹配的氧化物做衬底,所生长的薄膜与衬底之间存在较强的化学键,很难将其从衬底上大面积地剥离下来,所以也无法实现下一步转移到可用于高密度器件集成的的Si基衬底上。文章使用水溶Sr3Al2O6 (SAO)为牺牲层的方法,将生长在Nb-SrTiO3(Nb-STO)衬底上的BTO外延薄膜可以大面积、无褶皱地转移到Si基衬底上。并且,转移后的自支撑薄膜仍然保持了完美的结晶度和室温铁电性。此结论对自支撑氧化物薄膜在高密度铁电器件的集成方面奠定了一定的基础。

     

    Abstract: BaTiO3 (BTO) ferroelectric oxide thin films have attracted extensive attention due to their potential applications in non-volatile information storage, intelligent sensing, biomedicine, nanogenerators and other fields. At present, in order to ensure the high-quality epitaxial growth of BTO thin films, lattice-matched oxides are usually selected as substrates, and there is a strong chemical bond between the grown thin film and the substrate, which is difficult to peel it off from the substrate, so it cannot be transferred to the Si substrate that can be used for high-density device integration. In this paper, the BTO epitaxial thin film grown on Nb-SrTiO3 (Nb-STO) substrate is transferred to Si substrate without folds by using water-soluble Sr3Al2O6 (SAO) as a sacrificial layer. Moreover, the freestanding thin films still maintain perfect crystallinity and room-temperature ferroelectric properties. This conclusion establishes a certain foundation for the use of freestanding oxide thin films in the integration of high-density ferroelectric devices.

     

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