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真空加速键合界面水逸散机制的研究

The Mechanism of Water Evaporation at the Vacuum Accelerated Bonding Interface

  • 摘要: 氢氧催化键合强度受键合溶液参数、固化时间和温度等多种因素影响,在常温环境下固化需要等待4周才能完成键合,低温加热虽然可以加速固化、缩短时间,却无法适用于热敏感精密器件。为解决这一问题,本文创新性地提出了真空辅助氢氧催化键合的方法,通过真空环境加速键合界面水的逸散,以Hertz-Knudsen方程为基础,利用双腔室超高真空系统结合四极质谱仪实时监测水分压(表征水逸散通量),搭配微量天平测量样品失重(表征水逸散量),并通过键合强度测试来验证工艺有效性。结果表明,真空环境下,键合界面水逸散通量较常压显著提升;预键合后经24 h常压固化+ 4 h真空处理后,平均键合强度达11.31 MPa,固化周期从4周缩短至28 h,且满足热敏感精密器件需求。研究证实,真空是促进键合界面水逸散的高效方式,修正H-K方程可描述其加速机制。

     

    Abstract: The bonding strength of hydro-catalytic bonding is influenced by multiple factors such as bonding solution parameters, curing time, and temperature. Curing at room temperature requires 4 weeks to complete the bonding process. While low-temperature heating can accelerate curing and shorten the time, it is not suitable for heat-sensitive precision devices. To address this issue, this study innovatively proposes a vacuum-assisted hydro-catalytic bonding method. By utilizing a vacuum environment to accelerate the escape of water from the bonding interface, and based on the Hertz-Knudsen equation, an ultra-high vacuum dual-chamber system combined with a quadrupole mass spectrometer is used to monitor water vapor pressure in real time (characterizing the water escape flux). This is complemented by a microbalance to measure sample weight loss (characterizing the amount of water escaped), and bonding strength tests to verify the process effectiveness. The results show that the water escape flux at the bonding interface is significantly higher under vacuum than under atmospheric pressure. After pre-bonding followed by 24 h of atmospheric curing and 4 h of vacuum treatment, the average bonding strength reaches 11.31 MPa, reducing the curing cycle from 4 weeks to 28 h, while meeting the requirements of heat-sensitive precision devices. The study confirms that vacuum is an efficient way to promote water escape at the bonding interface, and a modified H-K equation can describe its acceleration mechanism.

     

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