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非对称爪型干式真空泵转子型线设计与数值模拟

Profile Design and Numerical Simulation of a Novel Asymmetric Rotor for Claw-type Dry Vacuum Pumps

  • 摘要: 爪型干式真空泵因其无油、高效等优点广泛应用于半导体制造领域。针对传统爪型干式真空泵在含颗粒介质环境中易磨损的问题,本研究提出一种基于非对称不完全啮合原理的转子结构优化方法。通过理论推导建立了转子型线的参数方程,重点优化节圆半径比和爪尖直线倾角等关键几何参数,并利用数值模拟分析了新型转子的工作特性。结果表明,优化后的转子容积利用率提升至41.55%,混合阶段压力波动减少,颗粒通过性显著增强。新型爪式转子设计能够有效改善压力分布和速度分布,可使余隙腔内最高压力降低42.35%,提高真空泵的效率和可靠性。该设计不仅能有效降低能耗和延长设备寿命,同时显著提升了半导体制造的工艺稳定性。研究结果为开发适用于半导体及其相关产业的高性能爪型干式真空泵提供了重要的理论依据,具有重要的应用价值。

     

    Abstract: Claw-type dry vacuum pumps are widely used in the semiconductor manufacturing industry due to their oil-free and high-efficiency characteristics. To address the wear issues of traditional claw-type vacuum pumps in environments containing particulate media, this study proposes a rotor structure optimization method based on the principle of asymmetric incomplete meshing. Parametric equations for rotor profiles were established through theoretical derivation, with a focus on optimizing key geometric parameters such as the pitch circle radius ratio and the inclination angle of the claw tip. Numerical simulations were conducted to analyze the working characteristics of the novel rotors. The results indicate that the optimized rotor achieves a volumetric efficiency of 41.55%, reduces pressure fluctuations during the mixing phase, and significantly enhances particle transport performance. The asymmetric claw-type rotor design effectively improves pressure and velocity distributions, achieving a 42.35% reduction of the peak pressure in the residual clearance chamber, while enhancing the pump efficiency and reliability. This design not only reduces energy consumption and extends equipment lifetime but also significantly enhances the process stability of semiconductor manufacturing. The findings provide a solid theoretical foundation for developing high-performance claw-type dry vacuum pumps suitable for the semiconductor and related industries, offering substantial application value. These findings provide valuable insights for the development of high-performance claw-type dry vacuum pumps in semiconductors and related industries.

     

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