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高功率脉冲磁控溅射制备C:Ni:Cu体系薄膜及其热分解制备少层石墨烯

Few-layer Graphene Growth by Annealing C:Ni:Cu Film Deposited by High Power Impulse Magnetron Sputtering

  • 摘要: 石墨烯作为一种先进的功能碳材料得到了广泛应用,本研究通过对高功率脉冲磁控溅射 (HiPIMS) 技术沉积的C:Ni:Cu体系薄膜的快速热退火,在300 nm SiO2/Si基底上直接制备石墨烯。研究了C2H2流量、薄膜厚度、工作气压、退火温度、退火时间及退火升温速率等参数对石墨烯层数和质量的影响,在上述参数分别为2 sccm、48 nm、0.3 Pa、900℃、10 min、15℃/s时,成功制备了低缺陷密度的少层(I2D/IG ≈ 1.23,ID/IG ≈ 0.45,FWHM ≈ 71 cm−1)石墨烯。实验结果提供了一种较低温度下(700℃)在所需衬底上直接合成石墨烯的方法,对石墨烯制备技术的发展及石墨烯材料的应用具有重要意义。

     

    Abstract: As a high-performance carbon material, graphene has found various applications. In this study, graphene has been directly prepared on 300 nm SiO2/Si substrates by rapid thermal annealing of C:Ni:Cu films deposited by high power impulse magnetron sputtering (HiPIMS). The parameters affecting the number of layers and quality of graphene during preparation have been systematically investigated, including C2H2 flow rate, film thickness, gas pressure, annealing temperature, annealing time, and heating rate. Few-layer high quality (I2D/IG ≈ 1.23, ID/IG ≈ 0.45, FWHM ≈ 71 cm−1) graphene has been successfully fabricated at the above parameters of 2 sccm, 48 nm, 0.3 Pa, 900℃, 10 min, and 15℃/s, respectively. The experimental results provide a method for synthesizing graphene directly on the desired substrate at low temperatures (700℃), which is significant for the development of graphene preparation technology and the application of graphene materials.

     

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