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强流脉冲电子束作用下Cu表面合金化Mo研究

Surface Alloying on Cu with Mo by High-Current Pulsed Electron Beam Irradiation

  • 摘要: 钼(Mo)与铜(Cu)之间属于二元互不固溶体系,然而结合了Mo的高温硬度和强度以及Cu的导电导热等优异性能的Cu-Mo复合材料却在电触头、散热元件等领域有着重要的应用。存在的问题是Cu-Mo之间的固溶度极低,难以实现合金化,从而极大地限制了Cu-Mo复合材料优异性能的发挥。该研究尝试采用强流脉冲电子束(HCPEB)技术实现Cu-Mo互不固溶体系的合金化,从而达到改善材料表面力学性能的目的。利用HCPEB辐照预制Mo涂层粉的Cu基体进行辐照,研究不同脉冲次数对样品固溶度、相结构和表面硬度的影响。结果表明,HCPEB辐照可以有效提高Cu-Mo互不固溶体系的固溶度,15次辐照后,Mo在Cu基体中的固溶度达到最高;随辐照次数增加,Cu(Mo)固溶体受热脱溶影响导致合金层中的固溶度反而有所降低。微观结构图像显示,15次HCPEB辐照后样品表层中可观察到大量的球形以及摩尔形态的Mo颗粒;当辐照次数增加到35次后,Mo颗粒大多倾向于分布在晶体缺陷处,且脱溶析出的Mo颗粒与基体存在一定的取向关系。性能测试结果表明,HCPEB合金化处理后Cu(Mo)合金化表层的硬度与辐照次数呈统一变化趋势,即随辐照次数增加显著提升,固溶强化、位错强化和弥散强化机制的共同作用是合金化表层性能改善的原因之所在。

     

    Abstract: Molybdenum (Mo) and copper (Cu) belong to the binary mutually insoluble system. However, Copper-molybdenum (Cu-Mo) composite materials, which combine the high-temperature hardness and strength of Mo with the excellent conductivity and thermal conductivity of Cu, have important applications in electric contacts, heat dissipation components, and other fields. The problem is that the solid solubility between Cu-Mo is extremely low, making it difficult to achieve alloying, which greatly limits the excellent performance of Cu-Mo composite materials. In this study, high current pulsed electron beam (HCPEB) irradiation technology was used to realize the surface alloying of the Cu-Mo immiscible system to improve the properties of materials. HCPEB was used to irradiate the Cu matrix of Mo coating powder prepared, and the effects of different pulse times on the solid solubility, phase structure, and surface hardness of the sample were studied. The results show that HCPEB irradiation can effectively improve the solid solubility of the Cu-Mo mutually insoluble system. The maximum level of solid solubility of Mo in the Cu lattices is reached after 15-pulsed irradiation. The microstructure image shows that a large number of spherical and molar Mo particles can be observed in the surface layer of the sample after 15 HCPEB irradiation. When the number of irradiation increases to 35 times, Cu(Mo) solid solubility decreases due to the thermal decomposition of Cu(Mo) solid solution. Microstructural characterization shows that a large number of spherical and molar Mo particles can be observed in the surface layer of the irradiated sample after HCPEB irradiation. After multiple pulse irradiations, most of the Mo particles tend to be distributed at crystal defects. There is a certain orientation relationship between the precipitated Mo particles and the Cu matrix. The performance test results show that the surface hardness of the HCPEB irradiated sample with Mo increases significantly with the increase of pulse numbers. The performance test results show that the hardness of the Cu(Mo) alloying surface layer significantly increases with the increase of irradiation times after HCPEB alloying treatment. This is not only the result of solid solution strengthening, but also the dislocation strengthening and dispersion strengthening of small Mo phases in the Cu(Mo) alloying surface layer jointly improve the properties of the alloying surface layer.

     

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