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气体组分对大气压Ar/O2/SiH4放电影响的数值模拟研究

Numerical Simulation of the Effect of Gas Composition on Ar/O2/SiH4 Discharge at Atmospheric Pressure

  • 摘要: 本文借助于二维流体力学模型对大气压下Ar/O2/SiH4放电进行了研究,重点关注了气体组分变化对前驱物粒子密度以及二氧化硅薄膜均匀性的影响。模拟结果表明:O2含量在整个放电体系中起决定性作用。当SiH4含量一定时,增加O2含量可以在不改变电子密度的同时,较大程度提高薄膜的沉积速率、优化薄膜的均匀性。SiH4含量主要对前驱物粒子SiH3O密度有较大影响,对薄膜的贡献却很小。值得注意的是,当O2含量与SiH4相等时,SiH3O粒子的生成通道占据主导地位,其密度较高;而当O2含量大于SiH4时,SiH2O的生成通道会占据主导地位,其密度高于SiH3O密度,同时SiO2密度大幅提高,可以达到1017cm-3。因此在实际工业制备大面积薄膜的过程中,提高O2含量有助于获得较高的沉积速率和高质量薄膜。

     

    Abstract: A two-dimensional fluid model is developed to study the radio-frequency atmospheric-pressure Ar/O2/SiH4 discharges.The effect of gas composition on the densities of precursor particles and the uniformity of silicon dioxide film is emphasized.The simulation results show that the content of O2 plays a decisive role in the whole discharge system.When the content of SiH4 is constant,increasing the contents of O2 can greatly increases the deposition rate and optimizes the uniformity of the film without changing the electron density.Although SiH4 content significantly influencing the density of SiH3O,it has little effect on the film properties.Note,when O2 content is equal to SiH4,the formation channel of SiH3O particles is dominant and its density is high.When O2 content is greater than SiH4,SiH2O generation channel will be dominate and its density is greater than that of SiH3O.Meanwhile,the density of SiO2 increases greatly,and it can reach 1017 cm-3.Therefore,in the actual industrial preparation of largearea films,increasing the O2 content is helpful to obtain high deposition rate and high quality films.

     

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