Abstract: With the development and application of 5G,big data and other new generation information technologies,there is a more increasing demand for memory chips. 3D NAND technology has quickly become the mainstream technology in the field of memory chips with the advantages of low cost and high storage density. Domestic projects are quite different from international first-class manufacturers in terms of clean room space planning,onetime investment and operating costs. The production process has a great impact on the plant design. The selection and configuration of process equipment directly affect the area demand for clean room,power supply quality and consumption requirements. This paper analyzes the etching process,equipment selection and quantity configuration in the manufacturing process of 3D NAND memory chips and the selection requirements of etching equipment according to the characteristics of different processes. For the change of different stacking layers,the internal logic of the change of the quantity of etching equipment is studied. It provides strong support for the production line of 3D NAND project and the preliminary planning of engineering design.