聚酯切片真空干燥过程的模拟研究
Simulation Study on the Vacuum Drying Process of Polyester Chips
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摘要: 为研究聚酯切片真空干燥工艺对切片含水量的影响,本文利用Fluent软件建立聚酯切片真空干燥模型,对不同工艺条件下切片的含水量进行模拟计算,结果表明,温度越高,初始含水量越高,真空度越高,堆积厚度越小,聚酯切片层平均含水量下降的越快,干燥速率越快,所需干燥时间越少。利用模型得到了不同含水量聚酯切片真空干燥的适宜工艺条件。聚酯切片含水量要达到50 mg/kg以下,初始含水量为2000 mg/kg时,切片可平铺10 mm厚,温度130℃,真空度100 kPa,干燥20 h;初始含水量为8000 mg/kg时,可平铺5 mm厚,温度150℃,真空度100 kPa,干燥30 h。Abstract: In order to study the effect of the vacuum drying process of polyester chips on the moisture content of chips, this paper uses Fluent software to establish a vacuum drying model for polyester chips, and simulates the moisture content of chips under different process conditions. The results show that the higher the temperature, the higher the initial moisture content, the higher the vacuum degree, the smaller the stacking thickness, and the faster the average moisture content of the polyester chip layer decreases. The faster the drying rate is, the shorter the drying time required. The suitable process conditions for vacuum drying of polyester chips with different moisture content were obtained by using the model. The moisture content of polyester chips should be less than 50 mg/kg. When the initial moisture content is 2000 mg/kg, the chips can be tiled with a thickness of 10 mm, the temperature is 130℃, the vacuum degree is 100 k Pa, and the drying time is 20 h; when the initial moisture content is 8000 mg/kg, it can be tiled with a thickness of 5 mm, the temperature is 150℃, the vacuum degree is 100 kPa, and the drying time is 30 h.