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FU Xuecheng, CHEN Liang, WANG Ying, DU Hongji, SHI Kaixuan. Process Optimization for Eliminating Stress Ring Defects in Magnetron Sputtered Cr FilmsJ. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY. DOI: 10.13922/j.cnki.cjvst.202602018
Citation: FU Xuecheng, CHEN Liang, WANG Ying, DU Hongji, SHI Kaixuan. Process Optimization for Eliminating Stress Ring Defects in Magnetron Sputtered Cr FilmsJ. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY. DOI: 10.13922/j.cnki.cjvst.202602018

Process Optimization for Eliminating Stress Ring Defects in Magnetron Sputtered Cr Films

  • To address the issues of periodic concentric circular fringes and stress ring defects observed in the magnetron sputtering deposition of Cr thin films, this paper proposes a process optimization strategy combining working pressure regulation with dual-target co-sputtering. The effects of various working pressures and target configurations on stress distribution were systematically investigated and compared through experiments. The results indicate that increasing the working pressure and introducing a dual-target confocal facing sputtering configuration can significantly enhance the scattering of sputtered particles during transport, thereby effectively mitigating the bombardment of high-energy particles on the substrate. The optimized process successfully eliminated the concentric circular fringe defects on the film surface and significantly improved the uniformity of stress distribution, providing a reproducible technical pathway for the fabrication of high-quality chromium thin films.
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