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LIU Xiaoming, ZENG Yu, CHEN Hai, SHI Hongfei, ZHENG Jiayuan. Simulation of Ablation Resistance and Self-repairing Behavior of CuCr Electrode in VacuumJ. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY. DOI: 10.13922/j.cnki.cjvst.202508013
Citation: LIU Xiaoming, ZENG Yu, CHEN Hai, SHI Hongfei, ZHENG Jiayuan. Simulation of Ablation Resistance and Self-repairing Behavior of CuCr Electrode in VacuumJ. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY. DOI: 10.13922/j.cnki.cjvst.202508013

Simulation of Ablation Resistance and Self-repairing Behavior of CuCr Electrode in Vacuum

  • To study the microscopic characterization method of the ablation resistance and self-repairing performance of the anode surface in the current zero region, CuCr alloy models were established by adding 10 at%, 20 at%, 30 at%, 40 at% and 50 at% of Cr atoms respectively according to the special quasi-random structure. Considering the Marangoni effect, a microscopic model of electrode ablation resistance was constructed, and a molecular dynamics behavior numerical simulation was carried out to explore the influencing factors of the self-repairing characteristics of electrode materials. The research results show that when the electrode material composition is the same, the arcing energy increases and the electrode ablation degree intensifies; when the electrode material and arcing energy are the same, the environmental temperature rises and the material self-repairing degree weakens. When the arcing energy is the same, with the increase of Cr content in the electrode material, the ablation resistance performance of CuCr alloy electrodes shows an increasing trend, following the positive correlation of CuCr50>CuCr40>CuCr30>CuCr20>CuCr10, while the self-repairing ability shows a negative correlation.
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