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HE Yadong, YUAN Gang, LI Tuo, ZHOU Yi, CHENG Xiaomin, HUO Zongliang. The Mechanism and the Prevention of Plasma Enhanced Atomic Layer Deposition Induced Polysilicon Damage[J]. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY, 2024, 44(6): 552-558. DOI: 10.13922/j.cnki.cjvst.202401024
Citation: HE Yadong, YUAN Gang, LI Tuo, ZHOU Yi, CHENG Xiaomin, HUO Zongliang. The Mechanism and the Prevention of Plasma Enhanced Atomic Layer Deposition Induced Polysilicon Damage[J]. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY, 2024, 44(6): 552-558. DOI: 10.13922/j.cnki.cjvst.202401024

The Mechanism and the Prevention of Plasma Enhanced Atomic Layer Deposition Induced Polysilicon Damage

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  • Received Date: January 29, 2024
  • Available Online: May 24, 2024
  • In this study, electron beam inspection (EBI) was used to investigate the mechanism of irreversible damage caused by by-products of the aminosilane precursors during the deposition of silicon oxide thin films with plasma enhanced atomic layer deposition (PEALD). It is proposed to replace polyamine based aminosilane with monoamine based aminosilane as precursors to reduce the damage to polysilicon materials. The effect of monoamine based diisopropylamine (DIPAS) precursors with small steric hindrance on the reaction rate of PEALD silicon oxide was studied without the damage of polysilicon.

  • [1]
    Klaus J W, George S M. Growth of SiO2 at room temperature with the use of catalyzed sequential half-reactions[J]. Science,1997,278(5345):1934−1936 doi: 10.1126/science.278.5345.1934
    [2]
    Klaus J W, George S M. Atomic layer deposition of SiO2 at room temperature using NH3-catalyzed sequential surface reactions[J]. Surface Science,2000,447(1−3):81−90 doi: 10.1016/S0039-6028(99)01119-X
    [3]
    Du Y, George S M. SiO2 film growth at low temperatures by catalyzed atomic layer deposition in a viscous flow reactor[J]. Thin Solid Films,2005,491(1−2):43−53 doi: 10.1016/j.tsf.2005.05.051
    [4]
    Kim D H, Lee H J, Jeong H, et al. Thermal atomic layer deposition of device-quality SiO2 thin films under 100°C using an aminodisilane precursor[J]. Chemistry of Materials,2019,31(15):5502−5508 doi: 10.1021/acs.chemmater.9b01107
    [5]
    Maeng W J, Kim H. Thermal and plasma-enhanced ALD of Ta and Tioxide thin films from alkylamide precursors[J]. Electrochemical and Solid-State Letters,2006,9(6):191−194 doi: 10.1149/1.2186427
    [6]
    Yang J H, Baek S B, Kim Y C. Initial surface reaction of di-isopropylaminosilane on a fully hydroxyl-terminated Si (001) surface[J]. Journal of Nanoscience and Nanotechnology,2014,14(10):7954−7960 doi: 10.1166/jnn.2014.9474
    [7]
    Suzuki I, Dussarrat C, Yanagita K. Extra low-temperature SiO2 deposition using aminosilanes[J]. Ecs Transactions,2007,3(15):119−118 doi: 10.1149/1.2721480
    [8]
    Baek S B, Kim D H, Kim Y C. Adsorption and surface reaction of bis-diethylaminosilane as a Si precursor on an OH-terminated Si (001) surface[J]. Applied surface science,2012,258(17):6341−6344 doi: 10.1016/j.apsusc.2012.03.033
    [9]
    Burton B B, Kang S W, Rhee S W, et al. SiO2 atomic layer deposition using tris (dimethylamino) silane and hydrogen peroxide studied by in situ transmission FTIR spectroscopy[J]. The Journal of Physical Chemistry C,2009,113(19):8249−8257 doi: 10.1021/jp806638e
    [10]
    Jeong Y C, Baek S B, Kim D H, et al. Initial reaction of silicon precursors with a varying number of dimethylamino ligands on a hydroxyl-terminated silicon (001) surface[J]. Applied surface science,2013,280:207−211 doi: 10.1016/j.apsusc.2013.04.129
    [11]
    Ferguson J D, Smith E R, Weimer A W, et al. ALD of SiO2 at room temperature using TEOS and H2O with NH3 as the catalyst[J]. Journal of The Electrochemical Society,2004,151(8):528−535 doi: 10.1149/1.1768548
    [12]
    Lee W J, Han C H, Park J K, et al. Atomic layer deposition and properties of silicon oxide thin films using alternating exposures to SiH2Cl2 and O3[J]. Japanese Journal of Applied Physics,2010,49(7):01−04
    [13]
    Lee J H, Kim U J, Han C H, et al. Investigation of silicon oxide thin films prepared by atomic layer deposition using SiH2Cl2 and O3 as the precursors[J]. Japanese journal of applied physics,2004,43(3A):328−330 doi: 10.1143/JJAP.43.L328
    [14]
    Kang J K, Musgrave C B. Mechanism of atomic layer deposition of SiO2 on the silicon (100)-2×1 surface using SiCl4 and H2O as precursors[J]. Journal of applied physics,2002,91(5):3408−3414 doi: 10.1063/1.1436294
    [15]
    George S M. Atomic layer deposition: an overview[J]. Chemical Review,2010,110(1):111−131 doi: 10.1021/cr900056b
    [16]
    Ding Y Y, Zhang Y C, Ren Y M, et al. Machine learning based modeling and operation for ALD SiO2 thin films using data from a multiscale CFD simulation[J]. Chemical Engineering Research and Design,2019,151:131−145 doi: 10.1016/j.cherd.2019.09.005
    [17]
    Huang L, Han B. Density functional theory study on the full ALD process of silicon nitride thin film deposition via BDEAS or BTBAS and NH3[J]. Physical Chemistry Chemical Physics,2014,16(34):18501−18512 doi: 10.1039/C4CP02741H
    [18]
    Nam T, Lee H, Choi T, et al. Low-temperature, high-growth-rate ALD of SiO2 using aminodisilane precursor[J]. Applied Surface Science,2019,485:381−390 doi: 10.1016/j.apsusc.2019.03.227
    [19]
    Musgrave C B, Gordon R G. Precursors for atomic layer deposition of high-k dielectrics[J]. Future Fab International,2005,18:126−128
    [20]
    De V, Glen A. Kinetics and mechanisms of nitrate and ammonium formation during ozonation of dissolved organic nitrogen[J]. Water Research,2017,108(16):451−461
    [21]
    Lim s, Mcardell C S, Gunten U V. Relations of aliphatic amines with ozone: Kinetics and mechanisms[J]. Water Research,2019,157(15):514−528

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