CMP Process and Equipment Configuration of 3D NAND Memory Chip Production Line

With the rising of 5G, internet of things, automatic driving and other new industries, human society will produce a large amount of information data, which will greatly promote the rapid development of the memory chip industry. As the mainstream technology of memory chips, 3D NAND has the characteristics of multi-layer vertical stacking and high aspect ratio. In the production process of different technology nodes, equipment selection and quantity configuration have an important impact on the chip production line planning and design. Based on the X-tacking technology in 3D NAND, this paper analyzes the related problems of chemical mechanical planarization (CMP) process and equipment configuration. Through the analysis of the characteristics of different processes of CMP process, the selection and configuration of different equipment are determined. The process requirements of CMP under different technology nodes of 3D NAND are studied, and the corresponding equipment number configuration relationship is obtained by comparative analysis. This study provides a theoretical basis and guidance for the equipment selection and quantity configuration of 3D NAND project and provides support for the preliminary design of the project.