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DONG Xiaotian, LIU Xiangmei. Numerical Simulation of the Effect of Gas Composition on Ar/O2/SiH4 Discharge at Atmospheric Pressure[J]. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY, 2022, 42(12): 952-961. DOI: 10.13922/j.cnki.cjvst.202206003
Citation: DONG Xiaotian, LIU Xiangmei. Numerical Simulation of the Effect of Gas Composition on Ar/O2/SiH4 Discharge at Atmospheric Pressure[J]. CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY, 2022, 42(12): 952-961. DOI: 10.13922/j.cnki.cjvst.202206003

Numerical Simulation of the Effect of Gas Composition on Ar/O2/SiH4 Discharge at Atmospheric Pressure

  • A two-dimensional fluid model is developed to study the radio-frequency atmospheric-pressure Ar/O2/SiH4 discharges.The effect of gas composition on the densities of precursor particles and the uniformity of silicon dioxide film is emphasized.The simulation results show that the content of O2 plays a decisive role in the whole discharge system.When the content of SiH4 is constant,increasing the contents of O2 can greatly increases the deposition rate and optimizes the uniformity of the film without changing the electron density.Although SiH4 content significantly influencing the density of SiH3O,it has little effect on the film properties.Note,when O2 content is equal to SiH4,the formation channel of SiH3O particles is dominant and its density is high.When O2 content is greater than SiH4,SiH2O generation channel will be dominate and its density is greater than that of SiH3O.Meanwhile,the density of SiO2 increases greatly,and it can reach 1017 cm-3.Therefore,in the actual industrial preparation of largearea films,increasing the O2 content is helpful to obtain high deposition rate and high quality films.
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