Residual Stress at Soldered Glass Joint:A Simulation and Experimental Study

The soldering of two pieces of Ag-coated vacuum glass, an energy-saving window/door material, was empirically approximated, mathematically modeled, numerically simulated in finite element method with ANSYS and experimentally evaluated.The influence of the soldering conditions, including the soldering temperature, holding time, solder thickness and pressure, on the shear strength and residual stress was investigated in 4-factor 4-level orthogonal test and shear strength measurement.The results show that the filler thickness and pressure had a major impact and the soldering temperature and holding-time had a minor impact.The orthogonal and shear strength tests results were in good agreement.The optimized soldering conditions included: a soldering temperature of 275℃,a holding time of 20 min, a solder thickness of 0.3 mm and a pressure of 8.56 N.Soldered under the optimized conditions, the soldered joint had the lowest residual stress and the strongest shear strength.