Outgassing-Rate in Baking of Multifilament Beam Profile Monitor of Synchrotron Accelerator
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Graphical Abstract
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Abstract
We experimentally addressed optimization of the backing conditions of synchrotron accelerator vacuum chamber installed with the beam profile monitor, comprising the gold-plated tungsten multifilament belt insulated with poly (ether-ether-ketone) (PEEK) coatings. The influence of the backing temperature and holding time on the outgassing rate was investigated with small-hole flow model in switching dual pumping path method (SPP). The results show that the optimized baking conditions included:a baking temperature of 150℃, a high temperature holding time of 24 h and a cooling time of 24 h. Baking at 150℃ greatly outperformed backing at 200℃, because of a much lower outgassing rate after cooling down to room temperature. Baking at 250℃ was found to seriously deform (or damage) the PEEK coatings of the multifilament beam profile monitor.
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