Influence of Bias Power on Sheet Resistance of Ti and Cu Thin Films Deposited by Magnetron Sputtering

The Cu and Ti thin films were deposited by DC magnetron sputtering on substrate of Si wafer. The influence of the substrate bias power on the microstructures, thickness and sheet resistance of the Ti-and Cu-coatings was investigated with X-ray diffraction, energy dispersive spectroscopy and atomic force microscopy. The preliminary results show that the power of negative bias significantly affected the thickness and sheet resistance. As the bias power increased from 0. 0 W to 150 W, the thickness and sheet resistance of the Ti-coating decreased by 25% and by 18%, respectively, the thickness of the Cu-coating decreased by 5% but the sheet resistance increased four times. The posible mechanism responsible for the impact of bias power on synthesis and properties of Ti-and Cucoatings was tentativly discussed.