Thermal Fatigue Resistance Enhancement of Laminated Copper Foil

Herein, we experimentally addressed the thermal fatigue resistance enhancement of laminated copper foil.The influence of the experimental conditions, including the e-beam power density and foil thickness, on the formation of surface cracks was quantitatively investigated with scanning electron microscope and computer image processing.The results show that depending on the foil thickness, the laminated copper foil displayed much stronger thermal fatigue resistance than bulk copper.For example, the cracks on folded-end surfaces of copper foil were much fewer, narrower, shorter and more difficult to propagate on the surfaces than those on bulk copper, possibly because of uniaxial stress state and less thermal stress; and a decrease of foil thickness considerably increased the thermal fatigue resistance.We suggest that the laminated copper foil may be good plasma facing and amorphous-ribbon cooling-roll materials.