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The Development of Ultrasensitive Leak Detection Technology
DONG Yunning, YAN Rui, LIANG Jinzhi, WEI Mengmeng, YU Rong, CUI Jian, CUI Yumei, TONG Yazhen, WANG Huan, WANG Xiyue, CHEN Junru, YANG Chuansen, QI Jing, LU Yaowen
2023, 43(8): 647-653. DOI: 10.13922/j.cnki.cjvst.202108018
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Effect of Process Condition on the Morphology and Properties of Fluorocarbon Polymer Coatings by PECVD
NI Haiying, CHEN Jun
2023, 43(8): 654-657. DOI: 10.13922/j.cnki.cjvst.202302011
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Synthesis of CdZnSe/ZnSe/ZnSeS Quantum Dot Materials and Performance in Quantum Dot Electroluminescent Devices
HUANG Qiaocan, YANG Zunxian, GUO Tailiang
2023, 43(8): 658-664. DOI: 10.13922/j.cnki.cjvst.202301004
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Comparative Study on Comprehensive Properties Prediction of DLC Thin Films Based on Different Neural Networks
CHEN Zhili, LIANG Shuai, LI Guohao, ZHAO Zhipeng, LIU Yutai, DU Guangyu
2023, 43(8): 665-673. DOI: 10.13922/j.cnki.cjvst.202212005
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Experimental Study on Start-up Performance of Sodium Heat Pipe with Metal-Foam Wick at Different Heating Temperatures
MA Tingting, ZHU Changjian, LI Yang, WANG Xiaobing, LI Sen
2023, 43(8): 674-680. DOI: 10.13922/j.cnki.cjvst.202301011
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The Influence of Electrode Structure and Wafer Material on Chuck Force of Coulomb Electrostatic Chuck
SUN Shizhuang, ZHAO Jinrong
2023, 43(8): 681-688. DOI: 10.13922/j.cnki.cjvst.202302012
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Particle Transport Characteristics in Low Vacuum Pipeline
DANG Wei, WANG Xudi, ZHANG Jun, BI Hailin, WU Jun
2023, 43(8): 689-696. DOI: 10.13922/j.cnki.cjvst.202302008
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Large Area Sterilization with Array Needle Ring Self-Excited Plasma Jet Device
ZHOU Zheng, ZHANG Yuhan, WANG Fengyun, DU Xiaoxia, ZHOU Fang, LI Hua
2023, 43(8): 697-705. DOI: 10.13922/j.cnki.cjvst.202301010
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Analysis of Internal Flow Field and Shell Pressure Pulse of Double Suction Liquid Ring Pump
ZHANG Yaowen, MENG Fanrui, MA Xiaozhong, ZHAO Xu, WANG Yunfei
2023, 43(8): 706-714. DOI: 10.13922/j.cnki.cjvst.202302015
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Analysis of Cavitation Characteristics of Stop Throttle Valve
WANG Qianting, WANG Junyu, ZHANG Kepeng, SONG Yongxing, ZHANG Linhua, LI Jianjun
2023, 43(8): 715-723. DOI: 10.13922/j.cnki.cjvst.202210022
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CMP Process and Equipment Configuration of 3D NAND Memory Chip Production Line
CHENG Xinghua, BAI Fan, ZHAO Xinfei, QIU Xuejiao
2023, 43(8): 724-730. DOI: 10.13922/j.cnki.cjvst.202212013
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