磁控溅射功率对半导体硅基表面FeCrNi涂层组织及性能的影响
Synthesis and Conductivityof Magnetron Co-Sputtered FeCrNi Coatings on Si-Wafer Substrate
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摘要: 为了提高半导体电阻涂层的质量以及导电能力,利用磁控溅射技术在半导体硅基表面制备FeCrNi涂层,通过实验测试的手段研究磁控溅射功率对其组织及性能的影响。研究结果表明:随着溅射功率提高,FCC固溶体发生了(111)晶面取向生长的现象,结晶度明显提高。当溅射功率增大后,有助于涂层中形成结构简单的固溶体组织,提高了涂层结晶度,涂层发生择优生长现象。在各溅射功率下FeCrNi涂层跟基底间达到了紧密结合的程度。较大溅射功率有助于形成了能量更高溅射原子,促进柱状组织发生更快生长,在涂层内形成了尺寸更大的晶粒。随着溅射功率的提高,涂层组织形成了更小的晶格常数。提高功率后,FeCrNi涂层发生了硬度减小,引起了晶粒粗化。随着功率提高,电阻率发生了逐渐减小,生成了许多柱状晶组织。Abstract: The conductive FeCrNi coatings were deposited by magnetron co-sputtering of the target,comprising distinct Ni,Cr and Fe componentd material,on Si substrate.The influence of the sputtering power on the microstructures,resistivity and hardness of the FeCrNi coatings was investigated with X-ray diffraction,scanning electron microscopy and hardness tester.The preliminary results show that the sputtering power significantly affected the microstructures and conductivity of the FeCrNi coatings.To be specific,as the sputtering power increased,the grain-size and crystallinity of the columnar(111) preferentially oriented FCC-structured grains increased,the lattice constant,surface hardness and resistivity decreased.In addition,the interfacial adhesion was found to increase with an increase of the sputtering power,as expected.
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